Step into the next era of production. Meet us at Interpack.

See you at Interpack.
From May 7 to 13 in Düsseldorf, Germany.
We look forward to welcoming you to discover three innovations you won’t want to miss: the integrated Tecno 3 AI assistant, the power of MDC, and an exclusive preview we’re still keeping under wraps.
Book your meeting
Let’s meet at the trade fair: book your meeting

TALK TO THE AI
Tecno 3 AI.

Introducing a new artificial intelligence system designed by Tecno 3.
The AI assistant, integrated directly into the machine’s control panel, answers questions about production and recipes, supports error management, and guides you through unexpected issues.

You type the question, and the AI responds.
Simple. Intuitive. Fast. In any language.

A step into the future of your production.

DISCOVER IT AT THE FAIR
MDC: the power of continuous processing.

MDC mixes and doses continuously, redefining time, flexibility, and waste reduction in the processing of chocolate, spreads, and compounds.

A solution that transforms the way you produce.

Consistent mixing for a more controlled and repeatable process.

Fast and precise recipe changes for flexible, waste-free production.

COMING SOON
An innovation you don’t expect.

We’re working on something that will open up a new path in the production process. A solution that expands our machine portfolio.

An absolute preview. Come and discover it at the trade fair.

LET’S MEET IN PERSON
See you at the fair.

Come to understand where the market is heading.
Come to design the plant that’s right for you, together.
Come to preview the future of your production.

We look forward to seeing you.
Book your meeting

See you here.
Hall 3 / Stand 3F91
Düsseldorf Exhibition Centre.